Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate

	Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate
	Zhang J(张静); Wan LX(万里兮); Liu FM(刘丰满); Li J(李君); Chen C(陈诚); Wu P(吴鹏)
刊名	Microelectronics Reliability
	2016-08-24
文献子类	期刊论文
内容类型	期刊论文
源URL	[http://159.226.55.106/handle/172511/16106]
专题	微电子研究所_系统封装与集成研发中心
作者单位	中国科学院微电子研究所
推荐引用方式 GB/T 7714	Zhang J,Wan LX,Liu FM,et al. Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate[J]. Microelectronics Reliability,2016.
APA	Zhang J,Wan LX,Liu FM,Li J,Chen C,&Wu P.(2016).Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate.Microelectronics Reliability.
MLA	Zhang J,et al."Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate".Microelectronics Reliability (2016).