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INVESTIGATION ON THERMAL RELEASE BEHAVIOR OF HELIUM-CHARGED COPPER FILMS BY DC MAGNETRON SPUTTERING
Qi, Q.; Wang, X. F.; Shi, L. Q.; Zhang, L.; Zhang, B.; Lu, Y. F.; Liu, A.
刊名FUSION SCIENCE AND TECHNOLOGY
2011-11-01
卷号60页码:1483-1486
ISSN号1536-1055
英文摘要Helium atoms are introduced into Cu films at roomn temperature by direct current (DC) magnetron sputtering in a He/Ar mixed atmosphere. The doped helium atoms are distributed evenly in the film and the content can be easily controlled by changing the process parameters. The structure of Cu films with trapped helium was investigated by X-ray diffraction (XRD) technology. With increasing helium irradiation flux, the lattice spacing and width of diffraction peaks increased due to helium effects, corresponding to the increase of finite and infinite size defects in the film. The shape of thermal desorption spectrum (TDS) and the number of peaks strongly depended on the amount of helium introduced into Cu. With increase of helium content, helium release temperature decreases. At the same amount of helium, the peak temperature became higher with increase of heating rate and from this we can obtain a picture which could calculate the activation energy of helium desorption.
WOS关键词BUBBLES
WOS研究方向Nuclear Science & Technology
语种英语
出版者AMER NUCLEAR SOC
WOS记录号WOS:000296674200067
内容类型期刊论文
源URL[http://119.78.100.186/handle/113462/34545]  
专题中国科学院近代物理研究所
通讯作者Shi, L. Q.
作者单位Fudan Univ, Inst Modern Phys, Appl Ion Beam Phys Lab, Shanghai 200433, Peoples R China
推荐引用方式
GB/T 7714
Qi, Q.,Wang, X. F.,Shi, L. Q.,et al. INVESTIGATION ON THERMAL RELEASE BEHAVIOR OF HELIUM-CHARGED COPPER FILMS BY DC MAGNETRON SPUTTERING[J]. FUSION SCIENCE AND TECHNOLOGY,2011,60:1483-1486.
APA Qi, Q..,Wang, X. F..,Shi, L. Q..,Zhang, L..,Zhang, B..,...&Liu, A..(2011).INVESTIGATION ON THERMAL RELEASE BEHAVIOR OF HELIUM-CHARGED COPPER FILMS BY DC MAGNETRON SPUTTERING.FUSION SCIENCE AND TECHNOLOGY,60,1483-1486.
MLA Qi, Q.,et al."INVESTIGATION ON THERMAL RELEASE BEHAVIOR OF HELIUM-CHARGED COPPER FILMS BY DC MAGNETRON SPUTTERING".FUSION SCIENCE AND TECHNOLOGY 60(2011):1483-1486.
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