| Dynamic behavior analysis of non-contacting hydrodynamic finger seal based on fluid-solid-interaction method | |
| Su, Hua; Wang, Jiru | |
| 2018 | |
| 关键词 | Commercial software Coupled fluid-solid interaction Dynamic behavior analysis Dynamic performance analysis Fluid solid interaction High-speed rotating Periodic excitations Structural deformation |
| 卷号 | 153 |
| 会议录 | MATEC Web of Conferences
 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2830270 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Su, Hua,Wang, Jiru. Dynamic behavior analysis of non-contacting hydrodynamic finger seal based on fluid-solid-interaction method[C]. 见:. |
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