Stabilizing nanoprecipitates in Al-Cu alloys for creep resistance at 300 degrees C | |
Gao, Y. H.; Yang, C.; Zhang, J. Y.; Cao, L. F.; Liu, G.; Sun, J.; Ma, E. | |
刊名 | MATERIALS RESEARCH LETTERS |
2019 | |
卷号 | 7页码:18-25 |
关键词 | Al alloys precipitates microalloying interfacial segregation creep resistance |
ISSN号 | 2166-3831 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2829185 |
专题 | 西安交通大学 |
推荐引用方式 GB/T 7714 | Gao, Y. H.,Yang, C.,Zhang, J. Y.,et al. Stabilizing nanoprecipitates in Al-Cu alloys for creep resistance at 300 degrees C[J]. MATERIALS RESEARCH LETTERS,2019,7:18-25. |
APA | Gao, Y. H..,Yang, C..,Zhang, J. Y..,Cao, L. F..,Liu, G..,...&Ma, E..(2019).Stabilizing nanoprecipitates in Al-Cu alloys for creep resistance at 300 degrees C.MATERIALS RESEARCH LETTERS,7,18-25. |
MLA | Gao, Y. H.,et al."Stabilizing nanoprecipitates in Al-Cu alloys for creep resistance at 300 degrees C".MATERIALS RESEARCH LETTERS 7(2019):18-25. |
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