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Breakdown enhancement of diamond Schottky barrier diodes using boron implanted edge terminations
Yu, Xinxin; Zhou, Jianjun; Wang, Yanfeng; Qiu, Feng; Kong, Yuechan; Wang, Hongxing; Chen, Tangsheng
刊名DIAMOND AND RELATED MATERIALS
2019
卷号92页码:146-149
关键词Diamond Boron implant Schottky diode Edge termination
ISSN号0925-9635
URL标识查看原文
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/2826768
专题西安交通大学
推荐引用方式
GB/T 7714
Yu, Xinxin,Zhou, Jianjun,Wang, Yanfeng,et al. Breakdown enhancement of diamond Schottky barrier diodes using boron implanted edge terminations[J]. DIAMOND AND RELATED MATERIALS,2019,92:146-149.
APA Yu, Xinxin.,Zhou, Jianjun.,Wang, Yanfeng.,Qiu, Feng.,Kong, Yuechan.,...&Chen, Tangsheng.(2019).Breakdown enhancement of diamond Schottky barrier diodes using boron implanted edge terminations.DIAMOND AND RELATED MATERIALS,92,146-149.
MLA Yu, Xinxin,et al."Breakdown enhancement of diamond Schottky barrier diodes using boron implanted edge terminations".DIAMOND AND RELATED MATERIALS 92(2019):146-149.
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