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	Experimental investigation of a thermosyphon with microstructure on the boiling surface
	Chai, Y.; Tian, W.; Tian, J.; Jin, L.W.; Meng, X.Z.; Dang, S.
刊名	Journal of Thermal Science and Engineering Applications
	2019
卷号	11
关键词	Bubble departure diameter Electronic technologies Experimental investigations Graphite foam Heat transfer correlation Heat transfer efficiency Pool boiling Thermal-physical property
ISSN号	1948-5085
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2826521
专题	西安交通大学
推荐引用方式 GB/T 7714	Chai, Y.,Tian, W.,Tian, J.,et al. Experimental investigation of a thermosyphon with microstructure on the boiling surface[J]. Journal of Thermal Science and Engineering Applications,2019,11.
APA	Chai, Y.,Tian, W.,Tian, J.,Jin, L.W.,Meng, X.Z.,&Dang, S..(2019).Experimental investigation of a thermosyphon with microstructure on the boiling surface.Journal of Thermal Science and Engineering Applications,11.
MLA	Chai, Y.,et al."Experimental investigation of a thermosyphon with microstructure on the boiling surface".Journal of Thermal Science and Engineering Applications 11(2019).

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