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	Reconfiguration algorithm for low temperature sub-array on VLSI/WSI arrays with faults
	Jigang, Wu ; Niu, Zhipeng ; Zhu, Yuanbo ; Srikanthan, Thambipillai ; Shen, Qingni
	2011
英文摘要	Temperature of the processing elements on integrated circuit threaten the reliability and performance of a hard real-time system. This paper presents a temperature-aware algorithm to reconfigure two-dimensional m x n VLSI/WSI arrays linked by 4-port switches in the presence of faulty processing elements. Based on dynamic programming, the proposed algorithm constructs each logical column with the lowest temperature for a cool target array on a given host array. Simulation results show that the temperature of target array is reduced without loss of harvest in comparison to the state-of-the-art. ? 2011 IEEE.; EI; 0
语种	英语
DOI标识	10.1109/IPFA.2011.5992733
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/328752]
专题	软件与微电子学院
推荐引用方式 GB/T 7714	Jigang, Wu,Niu, Zhipeng,Zhu, Yuanbo,et al. Reconfiguration algorithm for low temperature sub-array on VLSI/WSI arrays with faults. 2011-01-01.

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