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	Application of PECVD SiC in glass micromachining
	Zhang, Haixia ; Guo, Hui ; Chen, Zhe ; Zhang, Guobing ; Li, Zhihong
	2007
英文摘要	In this paper, we present an application of SiC for Pyrex glass micromachining in the MEMS fabrication process. SiC has very high etch resistance in most acid and alkaline solutions due to its chemical inertness. The PECVD (plasma-enhanced chemical vapor deposition) process allows deposition of SiC at a low temperature (200-400 ??C), which makes SiC have better compatibility with IC fabrication. The PECVD SiC film was characterized and the process was optimized accordingly. An annealing process was developed to reduce the residual stress and modify the interface adhesion, and therefore the mask defects as well as the undercut of glass were reduced. In our experiment, an etch angle of 41?? was achieved with an annealed SiC mask. Finally, microchannels on the glass substrate utilizing PECVD SiC mask were demonstrated, and SiC microstructures, such as membranes and clamed-clamed beams, were successfully fabricated by this micromachining technology. ? 2007 IOP Publishing Ltd.; EI; 4; 775-780; 17
语种	英语
DOI标识	10.1088/0960-1317/17/4/014
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/461640]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Zhang, Haixia,Guo, Hui,Chen, Zhe,et al. Application of PECVD SiC in glass micromachining. 2007-01-01.

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