Au-Si eutectic wafer bonding mechanism analysis and a intensity model | |
Wang, X. ; Zhang, D. ; Li, J. ; You, Z. ; Cai, B. | |
2007 | |
英文摘要 | Our experiments highlight that gold-silicon eutectics are fairly influenced by the thickness of Au layer and the wastage of Si, i.e. the wasting thickness of the silicon die. In the experiments, a bonding intensity testing method, called Press-arm model, is used to verify the Au-Si eutectics bonding strength. Through the intensity value of the bonding interface, we analyze the eutectics condition of the bonding interface at different temperatures and discuss the optimum procession of the wafer capsulation.; EI; 0 |
语种 | 英语 |
内容类型 | 其他 |
源URL | [http://ir.pku.edu.cn/handle/20.500.11897/327855] ![]() |
专题 | 信息科学技术学院 |
推荐引用方式 GB/T 7714 | Wang, X.,Zhang, D.,Li, J.,et al. Au-Si eutectic wafer bonding mechanism analysis and a intensity model. 2007-01-01. |
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