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	Analysis and modeling of thermal failure based on a MEMS thermally driven structure
	Lia, Xiuhan ; Yuan, Quan ; Lang, Leijie ; Liu, Jian ; Liu, Yu ; Fang, Dongming ; Zhang, Haixia
	2009
英文摘要	This paper presents an analysis of the thermal failure model of a MEMS thermal driven structure fabricated by MetalMump process. The finite element analysis was used to study the thermal electrical model and the experimental test results were compared with the simulated results. The parameters of the driven current applied on the structure which influence the system stability were considered, including the current value as well as the frequency. Avoiding thermal aggregation leading to structure destruction, the geometry factors of the structure design were also discussed to improve the heat conduction effect. ? 2009 SPIE.; EI; 0
语种	英语
DOI标识	10.1117/12.845904
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/327671]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Lia, Xiuhan,Yuan, Quan,Lang, Leijie,et al. Analysis and modeling of thermal failure based on a MEMS thermally driven structure. 2009-01-01.

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