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	Study of package technologies for implantable microdevices
	Li, Weihong ; Shi, Zhenjiang ; Guo, Hang ; Chen, Shiqing ; Li, Xiuhan ; Zhang, Haixia
	2008
英文摘要	This paper presents a study of packaging technologies for implantable microdevices. A RF microcoil is first designed and fabricated for implantable microdevices. Then, two methods using different materials and technologies for packaging have been developed. A RLC resonance circuit is adopted to test packaging performance. Measured results accord well with the predicted results from the circuit model and show that the method using multilayer Si xNy-SiO2-SixNy, dielectric thin films and silicone have better packaging performance to let the implanted microdevice be able to work chronically. Copyright ? 2008 by ASME.; EI; 0
语种	英语
DOI标识	10.1115/MicroNano2008-70194
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/327597]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Li, Weihong,Shi, Zhenjiang,Guo, Hang,et al. Study of package technologies for implantable microdevices. 2008-01-01.

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