Modeling and test analysis of electromagnetic compatibility of a power IC

CORC > 北京大学 > 信息科学技术学院

	Modeling and test analysis of electromagnetic compatibility of a power IC
	Yan, Wei ; Xu, Xifeng ; Kang, Qi ; Wang, Lei
刊名	sensor letters
	2014
DOI	10.1166/sl.2014.3284
英文摘要	Based on a Power IC chip which is a IGBT driven circuit designed by us, the paper describes simulation results whose model of IEC 62433 and IEC 62014-1 were adopted, testing results which adopted standards of IEC 61967 and IEC 62132, comparison with the simulation and measurement results together, all of simulation by IC-EMC software and measurement results show good trends, which demonstrate the simulation model are reasonable and accurate, but, the different value also exist. Simulation used models of IEC 62433 and IEC 62014-1 can help designer in design stage of Power IC to avoid EMI. Copyright ? 2014 American Scientific Publishers.; EI; 0; 2; 207-212; 12
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/295006]
专题	信息科学技术学院软件与微电子学院
推荐引用方式 GB/T 7714	Yan, Wei,Xu, Xifeng,Kang, Qi,et al. Modeling and test analysis of electromagnetic compatibility of a power IC[J]. sensor letters,2014.
APA	Yan, Wei,Xu, Xifeng,Kang, Qi,&Wang, Lei.(2014).Modeling and test analysis of electromagnetic compatibility of a power IC.sensor letters.
MLA	Yan, Wei,et al."Modeling and test analysis of electromagnetic compatibility of a power IC".sensor letters (2014).