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	Investigation on the Effects of Copper Electroplating Process
	Chen Yue ; Li Xiuhan ; Chen Shi Qing ; Zhang Haixia
	2008
关键词	copper electroplating current density grain diameter core cluster resistivity
英文摘要	This paper mainly discusses DC electroplating process parameter, especially the current density, affects the electroplating result (such as copper grain, surface smooth, resistivity). A positive relationship has been found between the current density and the electrodepositing speed, copper grain diameter, core cluster as well as square resistivity. Furthermore, testing structures are designed to monitor the process on line. And an observation of fluctuation along the transection has been found which is also increased with the current density.; Engineering, Electrical & Electronic; Engineering, Mechanical; Nanoscience & Nanotechnology; EI; CPCI-S(ISTP); 0
语种	英语
DOI标识	10.1115/MicroNano2008-70132
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/293693]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Chen Yue,Li Xiuhan,Chen Shi Qing,et al. Investigation on the Effects of Copper Electroplating Process. 2008-01-01.

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