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	Evaluation and Characterization of Titanium to Glass Anodic Bonding
	Shu, Qiong ; Su, Juan ; Zhao, Gang ; Wang, Ying ; Chen, Jing
	2008
关键词	Anodic bonding Titanium Glass wafer-to-wafer bonding METAL
英文摘要	In this paper, Ti-Glass anodic bonding is investigated on both chip and wafer level. In concern of coefficients of thermal expansion (CTE) match, three different types of ion-containing glasses are evaluated: Pyrex 7740, D-263T and soda lime glass. By applying a potential between the two chips and heating them beyond 350 degrees C, soda lime glass samples are successfully bonded with titanium. The influence of the bonding temperature on the bonding strength is revealed. For the first time, wafer level Ti-Glass bond is carried out, a 157-mu m-thick titanium wafer is successfully bonded to a 1000-mu m-thick soda glass wafer at 450 degrees C and applying a voltage of 800V and a force of 1000N for 30min, over 60% of the surface are joined. The results are helpful to define potential applications in certain field of microsystems.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000262479800110&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; Engineering, Mechanical; Nanoscience & Nanotechnology; EI; CPCI-S(ISTP); 0
语种	英语
DOI标识	10.1115/MicroNano2008-70111
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/293690]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Shu, Qiong,Su, Juan,Zhao, Gang,et al. Evaluation and Characterization of Titanium to Glass Anodic Bonding. 2008-01-01.

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