Fabrication of Complicated Three Dimensional Structures Utilizing Multi-stack Bonding | |
Zhou, Mingda ; Hao, Yilong ; Gao, Chengchen ; Li, Zhihong ; Hu, Qifang | |
2009 | |
关键词 | Anodic Bonding Multi-Wafer Bonding 3D structure Silicon Direct Bonding |
英文摘要 | Hybrid multi-wafer bonding that combines both anodic bonding and silicon direct bonding is one of the most promising manufacturing techniques for creating complex three-dimensional (3D) structures. However, the results of some key micro-fabrication processes will significantly influence the performance of 3D multilayered devices. These problems include: (1) electrical conduction property across the interface of hydrophilic direct bonded wafers; (2) the fabrication of silicon wire. Some key techniques are developed to solve these problems. These solutions are also applicable to fabricate other Microelectromechanical System devices with complex 3D structures.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000273161500255&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; CPCI-S(ISTP); 0 |
语种 | 英语 |
内容类型 | 其他 |
源URL | [http://ir.pku.edu.cn/handle/20.500.11897/293077] ![]() |
专题 | 信息科学技术学院 |
推荐引用方式 GB/T 7714 | Zhou, Mingda,Hao, Yilong,Gao, Chengchen,et al. Fabrication of Complicated Three Dimensional Structures Utilizing Multi-stack Bonding. 2009-01-01. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论