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	Fabrication of Complicated Three Dimensional Structures Utilizing Multi-stack Bonding
	Zhou, Mingda ; Hao, Yilong ; Gao, Chengchen ; Li, Zhihong ; Hu, Qifang
	2009
关键词	Anodic Bonding Multi-Wafer Bonding 3D structure Silicon Direct Bonding
英文摘要	Hybrid multi-wafer bonding that combines both anodic bonding and silicon direct bonding is one of the most promising manufacturing techniques for creating complex three-dimensional (3D) structures. However, the results of some key micro-fabrication processes will significantly influence the performance of 3D multilayered devices. These problems include: (1) electrical conduction property across the interface of hydrophilic direct bonded wafers; (2) the fabrication of silicon wire. Some key techniques are developed to solve these problems. These solutions are also applicable to fabricate other Microelectromechanical System devices with complex 3D structures.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000273161500255&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; CPCI-S(ISTP); 0
语种	英语
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/293077]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Zhou, Mingda,Hao, Yilong,Gao, Chengchen,et al. Fabrication of Complicated Three Dimensional Structures Utilizing Multi-stack Bonding. 2009-01-01.

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