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	Electrical Characterization of Cylindrical and Annular TSV for Combined Application Thereof
	Sun, Xin ; Cui, Qinghu ; Zhu, Yunhui ; Zhu, Zhiyuan ; Miao, Min ; Chen, Jing ; Jin, Yufeng
	2011
关键词	SILICON VIAS 3-D
英文摘要	In this paper, the potential application of combining cylindrical TSV and annular TSV into 3D integration was studied. First, the schematic fabrication process of cylindrical and annular TSV was proposed. Lumped equivalent circuit model of these different kinds of TSV structures from the physical configuration were studied and verified. Besides, 3D full wave electromagnetic (EM) simulations of cylindrical TSVs and annular TSVs were performed to verify the proposed lumped model of TSV.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000309781000018&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; EI; CPCI-S(ISTP); 0
语种	英语
DOI标识	10.1109/ICEPT.2011.6066794
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/292886]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Sun, Xin,Cui, Qinghu,Zhu, Yunhui,et al. Electrical Characterization of Cylindrical and Annular TSV for Combined Application Thereof. 2011-01-01.

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