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	Numerical simulation of a bulk micromachined relay with lateral contact
	Yang, ZC ; Li, ZH ; Xiao, ZY ; Hao, YL ; Wu, GY
	2002
关键词	microelectromechanical system (MEMS) relay finite element analysis (FEA) coupled analysis Reduced Order Modeling (ROM)
英文摘要	A bulk micromachined relay with lateral contact structure is presented in this paper. The relay is fabricated with glass/silicon wafer bonding and deep reactive ion etching (DRIE) process. It is laterally driven with electrostatic actuator. The threshold voltage of the relay is simulated using Reduced Order Modeling (ROM) methods provided by a general finite element simulator, ANSYS(TM). The simulated result and experimental result are compared and discussed.; Engineering, Multidisciplinary; Mathematics, Applied; Mechanics; Physics, Mathematical; SCI(E); CPCI-S(ISTP); 1
语种	英语
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/291563]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Yang, ZC,Li, ZH,Xiao, ZY,et al. Numerical simulation of a bulk micromachined relay with lateral contact. 2002-01-01.

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