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	Plastic-silicon bonding for MEMS packaging application
	Xia, Lou ; Zhihong, Li ; Yufeng, Jin
	2007
英文摘要	Packaging remains as a big problem for MEMS devices application due to a series of factors, including high cost and complicated processes. We present a new way for MEMS packaging based on plastic-silicon bonding. The packaging process here does not involve high temperature or some specific equipment. In fact, as for some applications process with manual operation would be enough. Besides, it can be easily applied to a wafer scale, which means a further reduction in cost. We choose Polymethylmethacrylate (PMMA) and Polycarbonate (PC) as our basic packaging materials and focus on the bonding technology between them and silicon. Three different bonding processes are included, with bonding strength tested in a standard way. Applications to different fluidic devices are also presented. ?2006 IEEE.; EI; 0
语种	英语
DOI标识	10.1109/ICEPT.2006.359792
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/263610]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Xia, Lou,Zhihong, Li,Yufeng, Jin. Plastic-silicon bonding for MEMS packaging application. 2007-01-01.

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