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	Design and fabrication of a novel monolithic integration structure for un-cooled infrared focal plane array and readout IC
	Ma, Shenglin ; Sun, Xin ; Zhu, Yunhui ; Cui, Qinghu ; Jin, Yufeng ; Yu, Xiaomei ; Chen, Jing ; Miao, Min
	2011
英文摘要	In this paper, a monolithic integration structure with TSV interconnections is introduced for un-cooled infrared FPA to do easy wafer-level-package. Firstly, the challenging process for making the structure will be reviewed and identified. And then process sequence for making the TSV interconnections and RDLs and CMOS compatible surface process for IR FPA will be developed. In the end, a WLP scheme will be developed to show the benefit of easy WLP. ? 2011 IEEE.; EI; 0
语种	英语
DOI标识	10.1109/EPTC.2011.6184394
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/263027]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Ma, Shenglin,Sun, Xin,Zhu, Yunhui,et al. Design and fabrication of a novel monolithic integration structure for un-cooled infrared focal plane array and readout IC. 2011-01-01.

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