Electroless copper plating applicable for bulk-silicon micromachined   radio frequency inductor

doi:10.1016/j.tsf.2006.03.017

CORC > 北京大学 > 信息科学技术学院

	Electroless copper plating applicable for bulk-silicon micromachined radio frequency inductor
	Han, Xiang ; Wu, Wengang ; Li, Yi ; Li, Zhihong ; Hao, Yilong ; Yan, Guizhen
刊名	固体薄膜
	2006
关键词	copper electroless chemical deposition RF inductor silicon CHIP SPIRAL INDUCTORS DEPOSITION ULSI
DOI	10.1016/j.tsf.2006.03.017
英文摘要	An electroless copper plating process has been developed for bulk-silicon micromachined radio frequency (RF) inductor. In the process, isotropic oxygen plasma bombardment is used for silicon surface pretreatment and activation time is optimized. High quality copper film with thickness up to 890 nm is plated on single-crystal silicon surface, resulting in low sheet resistivity of 0.04 Omega/square. The electroless copper plating technology is combined with bulk-silicon micromachining to fabricate a new kind of RF inductor consisting of suspended single-crystal silicon spiral with copper coated as conducting surface. A highly conformal copper coating layer is formed on every side of the suspended silicon spiral inductor using the plating process. Quality factor over 30 at 11 GHz and self-resonant frequency higher than 15 GHz are achieved for an inductance of 4 nH. Further inductor RF performance improvement by means of thicker copper coating is conceivable. (c) 2006 Elsevier B.V. All rights reserved.; Materials Science, Multidisciplinary; Materials Science, Coatings & Films; Physics, Applied; Physics, Condensed Matter; SCI(E); EI; 3; ARTICLE; 4; 2607-2611; 515
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/251182]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Han, Xiang,Wu, Wengang,Li, Yi,et al. Electroless copper plating applicable for bulk-silicon micromachined radio frequency inductor[J]. 固体薄膜,2006.
APA	Han, Xiang,Wu, Wengang,Li, Yi,Li, Zhihong,Hao, Yilong,&Yan, Guizhen.(2006).Electroless copper plating applicable for bulk-silicon micromachined radio frequency inductor.固体薄膜.
MLA	Han, Xiang,et al."Electroless copper plating applicable for bulk-silicon micromachined radio frequency inductor".固体薄膜 (2006).