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	Optimized Copper Line Aspect Ratio by Monte Carlo Method
	Wang, Zhuo Yan ; Du, Gang ; Kang, Jin Feng ; Liu, Xiao Yan ; Han, Ruqi
	2008
英文摘要	The copper interconnect comes into nanometers with the scaling down of device dimension. At the same time, the resistivity is increasing and the characteristic gets worse. In our paper, an optimal aspect ratio (AR) for Cu-line is found by Monte-Carlo (MC) method so that we can get the optimized electric conductivity and improve the performance of interconnection.; Engineering, Electrical & Electronic; Physics, Applied; EI; CPCI-S(ISTP); 0
语种	英语
DOI标识	10.1109/ICSICT.2008.4735039
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/153459]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Wang, Zhuo Yan,Du, Gang,Kang, Jin Feng,et al. Optimized Copper Line Aspect Ratio by Monte Carlo Method. 2008-01-01.

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