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	Single-Mask, Flip-Bonded Titanium-On-Glass (FBTOG) Technology for Wafer-Level Batch Fabrication of Suspended High-Aspect-Ratio Bulk Titanium Microstructures
	Zhang, Y. ; Zhao, G. ; Shu, Q. ; Tian, Y. ; Li, W. ; Chen, J.
	2009
关键词	Titanium-On-Glass High-Aspect-Ratio bulk titanium lateral relay
英文摘要	A Flip-Bonded Titanium-On-Glass (FBTOG) technology, which combines titanium Inductively-Coupled-Plasma (ICP) deep etching and adhesive wafer bonding technique, was developed to fabricate suspended in-plane high-aspect-ratio bulk titanium microstructures at wafer level. 25 mu m thick suspended structures with a trench aspect ratio of about 10 are demonstrated. A 2200 mu m-long comb-drive actuated bulk titanium lateral relay showed a contact resistance of 2.3 Omega at a moderate actuation voltage of 30V.; Chemistry, Multidisciplinary; Chemistry, Analytical; Electrochemistry; Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; EI; CPCI-S(ISTP); 2
语种	英语
DOI标识	10.1016/j.proche.2009.07.189
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/153347]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Zhang, Y.,Zhao, G.,Shu, Q.,et al. Single-Mask, Flip-Bonded Titanium-On-Glass (FBTOG) Technology for Wafer-Level Batch Fabrication of Suspended High-Aspect-Ratio Bulk Titanium Microstructures. 2009-01-01.

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