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	Evalution of Bulk Titanium DRIE Using SU-8 As Soft Mask
	Zhao, Gang ; Tian, Yao ; Shu, Qiong ; Chen, Jing
	2009
关键词	Titanium DRIE SU-8 softmask profile
英文摘要	This paper reports the characterization of bulk titanium deep etching using inductively coupled chlorine plasma using SU-8 as softmask. SU-8 has many advantages over the traditional employed hardmask, such as selective stripping, cost efficiency and the ability to accommodate ultra deep etching. The effects of process parameters (ICP source power, platen power and Cl(2) flow rate) on etch rate, selectivity and the etch profile were investigated. With the optimized process parameters (400 W ICP source power, 100 W platen power, 60 Seem 02 flow rate, 3 mT chamber pressure), an etch rate of 1.06 mu m/min has been achieved with an aspect ratio of 5:1 and smooth surface. Ultra-deep titanium etching up to 200 mu m has been realized with SU-8 softmask, which is among the best or the present reports.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000273161500119&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; EI; CPCI-S(ISTP); 0
语种	英语
DOI标识	10.1109/NEMS.2009.5068631
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/153271]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Zhao, Gang,Tian, Yao,Shu, Qiong,et al. Evalution of Bulk Titanium DRIE Using SU-8 As Soft Mask. 2009-01-01.

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