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	Spiral Capacitor based on Copper Electroplating
	Chen, Yue ; Li, Xiuhan ; Fang, Dongming ; Yuan, Quan ; Zhang, Haixia
	2009
关键词	Spiral capacitor HFSS copper electroplating integratable
英文摘要	A novel MEMS spiral capacitor on glass substrate has been designed, simulated and fabricated. The square spiral capacitors with different width, space, thickness and turn number have been studied by HFSS. The fabrication process has been developed based on copper electroplating, and it is compatible with the copper inductor fabrication process, which can be integrated into LC filter. Finally, spiral capacitors with different dimensions and LC filters have been fabricated successfully.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000273161500100&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; EI; CPCI-S(ISTP); 0
语种	英语
DOI标识	10.1109/NEMS.2009.5068612
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/153269]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Chen, Yue,Li, Xiuhan,Fang, Dongming,et al. Spiral Capacitor based on Copper Electroplating. 2009-01-01.

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