Wafer level bulk titanium ICP etching using SU8 as an etching mask

doi:10.1088/0960-1317/19/9/095006

CORC > 北京大学 > 信息科学技术学院

	Wafer level bulk titanium ICP etching using SU8 as an etching mask
	Zhao, Gang ; Shu, Qiong ; Tian, Yao ; Zhang, Yiming ; Chen, Jing
刊名	journal of micromechanics and microengineering
	2009
关键词	FABRICATION
DOI	10.1088/0960-1317/19/9/095006
英文摘要	Recent developments of ICP deep etching have allowed for the realization of bulk titanium high-aspect-ratio structures with high mechanical endurance, excellent corrosion resistance and bio-compatibility, which are very attractive for in vivo and/or harsh environment applications. In this paper, bulk titanium deep reactive ion etching (DRIE) has been carried out and evaluated at wafer level. A new mask material SU8 is introduced instead of an oxide hard mask, which has suffered from limited depth and laborious masking protocols. In order to optimize the process design, the influence of process parameters (coil power, platen power and Cl(2) flow rate) on the etch rate, surface roughness, etch profile and wafer uniformity was investigated. By varying these parameters, an optimized recipe is obtained; an etching rate of 1 mu min-1 has been achieved with a vertical sidewall profile and smooth floor. High-aspect-ratio comb finger structures and beams were fabricated on the titanium substrate, which can potentially be used to realize many novel titanium-based microelectromechanical systems (MEMS) devices. Ultra-deep grooves up to 200 mu m have been fabricated with this technology, which is among the best of the present reports.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000269474500026&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Instruments & Instrumentation; Materials Science, Multidisciplinary; Mechanics; SCI(E); EI; 7; EDITORIAL MATERIAL; 9; 19
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/152876]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Zhao, Gang,Shu, Qiong,Tian, Yao,et al. Wafer level bulk titanium ICP etching using SU8 as an etching mask[J]. journal of micromechanics and microengineering,2009.
APA	Zhao, Gang,Shu, Qiong,Tian, Yao,Zhang, Yiming,&Chen, Jing.(2009).Wafer level bulk titanium ICP etching using SU8 as an etching mask.journal of micromechanics and microengineering.
MLA	Zhao, Gang,et al."Wafer level bulk titanium ICP etching using SU8 as an etching mask".journal of micromechanics and microengineering (2009).