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	A bulk micromachined vibratory lateral gyroscope fabricated with wafer bonding and deep trench etching
	Li, ZH ; Yang, ZC ; Xiao, ZX ; Hao, YL ; Li, T ; Wu, GY ; Wang, YY
	2000
关键词	gyroscope micromachining wafer bonding MEMS deep trench etching SILICON
英文摘要	A bulk micromachined vibratory lateral gyroscope, which is fabricated with Silicon-glass wafer bonding and deep trench etching, has been developed. By using entirely symmetric springs, drive mode and sense mode frequencies of the gyroscope are matched precisely, which is important to improve sensitivity. The gyroscope has a large mass and capacitance, and its thermal-mechanical noise floor is estimated to be about 0.05 degrees/h/Hz(1/2). (C) 2000 Elsevier Science S.A. All rights reserved.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000087144800005&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; Instruments & Instrumentation; SCI(E); EI; CPCI-S(ISTP); 35
语种	英语
DOI标识	10.1016/S0924-4247(99)00375-1
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/151942]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Li, ZH,Yang, ZC,Xiao, ZX,et al. A bulk micromachined vibratory lateral gyroscope fabricated with wafer bonding and deep trench etching. 2000-01-01.

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