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	微量Te对Cu-30CrTe合金触头材料抗焊接性的影响; Effects of Trace Te on Anti-welding Property of Cu-30CrTe Alloy Contact Material
	苗柏和 ; 谢景林 ; 何建平 ; 刘国勋 ; 王文斌 ; 王小军
	2013
关键词	CuCr触头材料 抗焊接性 焊接结合面 显微组织 断裂特性 X射线光电子能谱 CuCr contact material anti-welding property faying surface microstructure fracture characteristics X-ray photoelectron spectroscopy(XPS)
DOI	10.3969/j.issn.1671-8887.2013.02.004
英文摘要	使用光学显微镜和扫描电镜(SEM)观察熔铸Cu-30CrTe、Cu-30Cr和烧结粉末冶金CuCr25等三种触头材料经真空扩散焊后的室温拉伸断口及焊接结合区纵断面的显微组织。三种触头材料具有不同的断裂特征，熔铸Cu-30CrTe材料焊接结合面的显微组织明显不同于烧结CuCr25；同时参考X射线光电子能谱(XPS)表面分析结果，对添加微量Te改进触头材料抗焊接性的机理和评判原则进行了讨论。; The tensile fracture at room temperature and the faying microstructures of vacuum casting Cu-30CrTe, Cu-30Cr and sintered CuCr25 contact materials after diffusion welding in vacuum were evaluated by optical microscope and SEM. It is found that there are different fracture characteristics in the materials and distinct microstructures formed at the faying surface of the Cu-30CrTe from that of the sintered CuCr25; meanwhile consulting the XPS surface analysis results of elemental content and valence state of trace Te in the Cu-30CrTe contact material, the mechanism and principles of trace Te improving the anti-welding property of the Cu-30CrTe alloy contact material are discussed.; 0; 2; 18-22
语种	中文
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/272757]
专题	化学与分子工程学院
推荐引用方式 GB/T 7714	苗柏和,谢景林,何建平,等. 微量Te对Cu-30CrTe合金触头材料抗焊接性的影响, Effects of Trace Te on Anti-welding Property of Cu-30CrTe Alloy Contact Material[J],2013.
APA	苗柏和,谢景林,何建平,刘国勋,王文斌,&王小军.(2013).微量Te对Cu-30CrTe合金触头材料抗焊接性的影响..
MLA	苗柏和,et al."微量Te对Cu-30CrTe合金触头材料抗焊接性的影响".(2013).

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