Surface strengthening behaviors of pure Cu with heterogeneous microstructures

doi:10.1016/j.msea.2018.05.008

CORC > 金属研究所 > 中国科学院金属研究所

	Surface strengthening behaviors of pure Cu with heterogeneous microstructures
	Ren, CX ; Wang, Q ; Zhang, ZJ ; Yang, HJ ; Zhang, ZF
刊名	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
	2018-06-06
卷号	727 页码:192-199
关键词	Cu Heterogeneous microstructure Surface spinning strengthening (3S) Microhardness Strength Gradient microstructure
ISSN号	0921-5093
DOI	10.1016/j.msea.2018.05.008
英文摘要	The surface strengthening behaviors of cold-rolled (CR) Cu, fully recrystallized (FR) Cu and partially recrystallized (PR) Cu with heterogeneous microstructures were investigated by using the surface spinning strengthening (3S) method. It was found that the heterogeneous microstructure significantly affects surface strengthening behaviors as the fine grains have good plastic deformation ability, the ultrafine grains can bear a high stress, and the whole hardened layer can be divided into grain refinement and deformation zones. The maximum microhardness is 173 HV across all Cu because all the grains were refined to the nano-scale with an average size of 40 nm in the topmost layer of the grain refinement zone. The fine grains in the deformation zone of the PR Cu deform plastically to generate a thick hardened layer. In addition, the surface strengthening behaviors and mechanisms are discussed in detail.
学科主题	Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
语种	英语
WOS记录号	WOS:000438000500022
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/80158]
专题	金属研究所_中国科学院金属研究所
作者单位	1.[Ren, C. X. 2.Wang, Q. 3.Zhang, Z. J. 4.Yang, H. J. 5.Zhang, Z. F.] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Mat Fatigue & Fracture Div, Shenyang 110016, Liaoning, Peoples R China 6.[Ren, C. X. 7.Zhang, Z. F.] Univ Sci & Technol China, Sch Mat Sci & Engn, Hefei 230026, Anhui, Peoples R China
推荐引用方式 GB/T 7714	Ren, CX,Wang, Q,Zhang, ZJ,et al. Surface strengthening behaviors of pure Cu with heterogeneous microstructures[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2018,727:192-199.
APA	Ren, CX,Wang, Q,Zhang, ZJ,Yang, HJ,&Zhang, ZF.(2018).Surface strengthening behaviors of pure Cu with heterogeneous microstructures.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,727,192-199.
MLA	Ren, CX,et al."Surface strengthening behaviors of pure Cu with heterogeneous microstructures".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 727(2018):192-199.