Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays | |
Zhang, Hongyou1,2; Zah, Chung-En4; Liu, Xingsheng2,3,4 | |
2019 | |
会议日期 | 2019-02-03 |
会议地点 | San Francisco, CA, United states |
关键词 | Thermal stress laser diode array SMILE effect spectrum |
卷号 | 10900 |
DOI | 10.1117/12.2506212 |
英文摘要 | High power laser diodes have been widely utilized in many fields, like industry, scientific research, military and medical treatment, etc. However, thermal stress induced by packaging process due to CTE-mismatch between chip and heat-sink is the main source causing near-field non-linearity along laser bar (also known as "SMILE"), decreasing the degree of polarization (DoP), broadening spectrum, and degrading the lifetime of laser diode array (LDA). In this paper, the effect of packaging induced thermal stress on high power laser diode arrays was studied theoretically and experimentally. The FEM simulation and photoluminescence (PL) experimental results showed the difference of packaging induced thermal stress based on different packaging structures. Spectrally resolved spectrum of LDA showed the packaging induced stress is highest in the middle and rapidly drops near both ends of laser bar, in agreement with our theoretical simulation, resulting in spectral broadening due to blue shifting the lasing wavelength of the center emitter more than the edge emitters. © COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only. |
产权排序 | 1 |
会议录 | High-Power Diode Laser Technology XVII |
会议录出版者 | SPIE |
语种 | 英语 |
ISSN号 | 0277786X;1996756X |
ISBN号 | 9781510624429 |
WOS记录号 | WOS:000474764900021 |
内容类型 | 会议论文 |
源URL | [http://ir.opt.ac.cn/handle/181661/31542] |
专题 | 西安光学精密机械研究所_瞬态光学技术国家重点实验室 |
通讯作者 | Zhang, Hongyou |
作者单位 | 1.State Key Laboratory of Transient Optics and Photonics, Xi'An Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi'an, Shanxi; 710077, China; 2.University of Chinese Academy of Sciences, Beijing; 100049, China; 3.Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing; 100049, China; 4.Focuslight Technologies Inc., Xi'an, Shanxi; 710077, China |
推荐引用方式 GB/T 7714 | Zhang, Hongyou,Zah, Chung-En,Liu, Xingsheng. Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays[C]. 见:. San Francisco, CA, United states. 2019-02-03. |
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