| The effect of air-damping on the planar MEMS structures | |
| Wang, XJ[1]; Liu, YW[2]; Wang, M[3]; Chen, XY[4] | |
| 2004 | |
| 会议名称 | PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04) |
| 关键词 | squeeze damping gas rarefaction microstructure |
| 页码 | 349-352 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2408531 |
| 专题 | 上海大学 |
| 作者单位 | Shanghai Univ, Sch Mechatron Engn & Automat, Shanghai 200072, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Wang, XJ[1],Liu, YW[2],Wang, M[3],et al. The effect of air-damping on the planar MEMS structures[C]. 见:PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04). |
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