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	Role of microstructure on surface and subsurface damage of sintered silicon carbide during grinding and polishing
	Gao, Jianqin1,2; Chen, Jian1; Liu, Guiling1; Yan, Yongpe1; Liu, Xuejian1; Huang, Zhengren1
刊名	Wear
	2010-12-02
卷号	270期号:1-2页码:88-94
关键词	Surface topography Sintered silicon carbide Fracture Afm Electron microscopy
ISSN号	0043-1648
DOI	10.1016/j.wear.2010.09.009
通讯作者	Huang, zhengren()
英文摘要	Sintered silicon carbide with different microstructures equiaxed grain (eq) and elongated grain (el) were prepared the role of microstructure on surface and subsurface damage during grinding and polishing was investigated at the same time the correlation between microstructure and material removal mechanism was studied the surface and subsurface damage were observed by atomic force microscope (afm) and transmission electron microscopy (tem) more grain pulling-out was found on the polished surface with eq than that with el the degree of grain pulling-out is related to aspect ratio and grain diameter of individual grains lateral cracks appeared in subsurface for silicon carbide samples with eq during grinding and polishing while only plastic deformation could be observed with el during polishing material removal mechanism was found to change from brittle fracture to plastic deformation for sintered silicon carbide ceramics with el as machine procedure moved on from grinding to polishing the research related surface and subsurface damage to the microstructure of sic ceramics and will provide valuable insights into the material removal mechanism (c) 2010 elsevier b v all rights reserved
WOS关键词	MATERIAL-REMOVAL MECHANISMS ; ALPHA-SIALON CERAMICS ; ALUMINA ; WEAR
WOS研究方向	Engineering ; Materials Science
WOS类目	Engineering, Mechanical ; Materials Science, Multidisciplinary
语种	英语
出版者	ELSEVIER SCIENCE SA
WOS记录号	WOS:000285667200011
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2406753
专题	中国科学院大学
通讯作者	Huang, Zhengren
作者单位	1.Chinese Acad Sci, Shanghai Inst Ceram, Shanghai 200050, Peoples R China 2.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China
推荐引用方式 GB/T 7714	Gao, Jianqin,Chen, Jian,Liu, Guiling,et al. Role of microstructure on surface and subsurface damage of sintered silicon carbide during grinding and polishing[J]. Wear,2010,270(1-2):88-94.
APA	Gao, Jianqin,Chen, Jian,Liu, Guiling,Yan, Yongpe,Liu, Xuejian,&Huang, Zhengren.(2010).Role of microstructure on surface and subsurface damage of sintered silicon carbide during grinding and polishing.Wear,270(1-2),88-94.
MLA	Gao, Jianqin,et al."Role of microstructure on surface and subsurface damage of sintered silicon carbide during grinding and polishing".Wear 270.1-2(2010):88-94.

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