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	Modelling of carbon nanotubes as heat sink fins in microchannels for microelectronics cooling
	Ekstrand, Lisa[1]; Mo, Zhimin[2]; Zhang, Yan[3]; Liu, Johan[4]
	2005
会议名称	Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
会议日期	2005-10-23
页码	185-187
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2399222
专题	上海大学
作者单位	[1]Sino-Swedish Microsystem Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Sweden [2]Sino-Swedish Microsystem Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Sweden [3]Key State Laboratory for New Displays and System Integration, SMIT Center, Shanghai University, Van Chang Road, No. 149, Shanghai 200072, China |Department of Applied Mechanics, Chalmers University of Technology, Sweden[4]Sino-Swedish Microsystem Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Sweden |Key State Laboratory for New Displays and System Integration, SMIT Center, Shanghai University, Van Chang Road, No. 149, Shanghai 200072, China
推荐引用方式 GB/T 7714	Ekstrand, Lisa[1],Mo, Zhimin[2],Zhang, Yan[3],et al. Modelling of carbon nanotubes as heat sink fins in microchannels for microelectronics cooling[C]. 见:Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. 2005-10-23.

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