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	Simulation study of bump metallization on the stress and strain distributions of ACF interconnections for flip-chip-on-flex (COF) applications
	Su, S.H.[1]; Zhao, K.[2]; Ma, S.W.[3]; Zhang, J.H.[4]
	2005
会议名称	2005 6th International Conference on Electronics Packaging Technology
会议日期	2005-08-30
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2399201
专题	上海大学
作者单位	[1]Key Lab. of Advanced Display Technology and System Application , Shanghai University, Ministry of Education, Shanghai 200072, China [2]Key Lab. of Advanced Display Technology and System Application , Shanghai University, Ministry of Education, Shanghai 200072, China [3]Key Lab. of Advanced Display Technology and System Application , Shanghai University, Ministry of Education, Shanghai 200072, China [4]Key Lab. of Advanced Display Technology and System Application , Shanghai University, Ministry of Education, Shanghai 200072, China |College of Mechanical and Electrical Engineering, Central-South University, Changsha 410083, China
推荐引用方式 GB/T 7714	Su, S.H.[1],Zhao, K.[2],Ma, S.W.[3],et al. Simulation study of bump metallization on the stress and strain distributions of ACF interconnections for flip-chip-on-flex (COF) applications[C]. 见:2005 6th International Conference on Electronics Packaging Technology. 2005-08-30.

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