A study of CFD simulation for on-chip cooling with 2D CNT micro-fin array | |
Zhong, Xiaolong[1]; Fan, Yi[2]; Liu, Johan[3]; Zhang, Yan[4]; Wang, Teng[5]; Cheng, Zhaonian[6] | |
2007 | |
会议名称 | HDP'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION |
会议日期 | 2007-06-26 |
页码 | 442-447 |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2389204 |
专题 | 上海大学 |
作者单位 | 1.Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 2.Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, 149,Yachang Rd, Shanghai 200072, Peoples R China. |
推荐引用方式 GB/T 7714 | Zhong, Xiaolong[1],Fan, Yi[2],Liu, Johan[3],et al. A study of CFD simulation for on-chip cooling with 2D CNT micro-fin array[C]. 见:HDP'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION. 2007-06-26. |
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