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	Fabrication and field-emission properties of large-area nanostructures of the organic charge-transfer complex cu-tcnaq
	Cui, Shuang1,2; Li, Yuliang1; Guo, Yanbing1,2; Liu, Huibiao1; Song, Yinglin3; Xu, Jialiang1,2; Lv, Jing1,2; Zhu, Mei1,2; Zhu, Daoben1
刊名	Advanced materials
	2008-01-18
卷号	20期号:2页码:309-+
ISSN号	0935-9648
DOI	10.1002/adma.200701617
通讯作者	Li, yuliang(ylli@iccas.ac.cn)
英文摘要	Transfer complexes of cu-tcnaq are fabricated through a facile dipping method. the well-aligned nanowalls array exhibits excellent field emission properties. the maximal current density of the nanowalls is higher than 11 ma cm(-2).
WOS关键词	THIN-FILMS ; CONJUGATED POLYMERS ; CONTROLLED GROWTH ; NANOROD ARRAYS ; NANOWIRES ; TCNQ=7,7,8,8-TETRACYANOQUINODIMETHANE ; ELECTROCRYSTALLIZATION ; MORPHOLOGY ; NANOWALLS ; OXIDES
WOS研究方向	Chemistry ; Science & Technology - Other Topics ; Materials Science ; Physics
WOS类目	Chemistry, Multidisciplinary ; Chemistry, Physical ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
语种	英语
出版者	WILEY-BLACKWELL
WOS记录号	WOS:000252869900017
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2385533
专题	中国科学院大学
通讯作者	Li, Yuliang
作者单位	1.Chinese Acad Sci, Inst Chem, CAS Key Lab Organ Solids, Beijing Natl Lab Mol Sci, Beijing 100080, Peoples R China 2.Chinese Acad Sci, Grad Sch, Beijing 100080, Peoples R China 3.Suzhou Univ, Sch Phys Sci & Technol, Suzhou 215006, Peoples R China
推荐引用方式 GB/T 7714	Cui, Shuang,Li, Yuliang,Guo, Yanbing,et al. Fabrication and field-emission properties of large-area nanostructures of the organic charge-transfer complex cu-tcnaq[J]. Advanced materials,2008,20(2):309-+.
APA	Cui, Shuang.,Li, Yuliang.,Guo, Yanbing.,Liu, Huibiao.,Song, Yinglin.,...&Zhu, Daoben.(2008).Fabrication and field-emission properties of large-area nanostructures of the organic charge-transfer complex cu-tcnaq.Advanced materials,20(2),309-+.
MLA	Cui, Shuang,et al."Fabrication and field-emission properties of large-area nanostructures of the organic charge-transfer complex cu-tcnaq".Advanced materials 20.2(2008):309-+.

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