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	Cure and thermal stability of an addition-cure-type thermoset pn-paa
	Wang, MG; Wei, LH; Zhao, T; Yu, RL; Feng, ZH
刊名	Acta polymerica sinica
	2006-04-01
期号	2页码:241-247
关键词	Pn resin Paa resin Reactive blends Miscibility Cure Thermal stability
ISSN号	1000-3304
通讯作者	Wang, mg(tzhao@iccaas.ac.cn)
英文摘要	The miscibility of reactive blends of pn (propargyl novolac) resin and paa (polyarylcetylene) resin was studied. evaluation on the storage stability, processability of the blends and thermal stability of the cured blends were also presented. as evidenced from phase observation, dsc analysis, sem and tem investigation, pn-paa reactive blends were completely homogeneous. compared with paa, the blends exhibited improved storage stability at room temperature. the blends could be cured in a controllable way, thus the processability of the blends was marginally improved compared with that of paa resin. dma and tga analyses indicated that the blends possessed high thermal stability (glass transition temperature as high as 380 degrees c). owing to the low viscosity of the blends and a proper gel time, as well as the elimination of volatiles during the curing process, the reactive blends are suitable for many processes including rtm (resin transfer mold) the reactive blends of pn resin and paa resin are amongst novel matrices of advanced materials for high temperature ablative and thermo-structural applications.
WOS关键词	COMPOSITES ; KINETICS
WOS研究方向	Polymer Science
WOS类目	Polymer Science
语种	英语
出版者	SCIENCE PRESS
WOS记录号	WOS:000236900500008
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2378749
专题	中国科学院大学
通讯作者	Wang, MG
作者单位	1.Chinese Acad Sci, Inst Chem, Lab High Tech Mat, Beijing 100080, Peoples R China 2.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China 3.Aerosp Res Inst Mat & Proc Technol, Beijing 100076, Peoples R China
推荐引用方式 GB/T 7714	Wang, MG,Wei, LH,Zhao, T,et al. Cure and thermal stability of an addition-cure-type thermoset pn-paa[J]. Acta polymerica sinica,2006(2):241-247.
APA	Wang, MG,Wei, LH,Zhao, T,Yu, RL,&Feng, ZH.(2006).Cure and thermal stability of an addition-cure-type thermoset pn-paa.Acta polymerica sinica(2),241-247.
MLA	Wang, MG,et al."Cure and thermal stability of an addition-cure-type thermoset pn-paa".Acta polymerica sinica .2(2006):241-247.

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