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	Recent Progress of Thermal Interface Materials
	Liu, Johan[1]; Wang, Teng[2]; Carlberg, Bj?rn[3]; Inoue, Masahiro[4]
	2008
会议名称	2nd Electronics System-Integration Technology Conference
会议日期	2008-09-01
页码	351-+
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2345600
专题	上海大学
作者单位	[1]SMIT Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, SE-412 96 G?teborg, Sweden |School of Automation and Mechanical Engineering, Yan Chang Campus, Shanghai University, Box 282, No. 149 Van Chang Road, Shanghai 200072, China [2]SMIT Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, SE-412 96 G?teborg, Sweden [3]SMIT Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, SE-412 96 G?teborg, Sweden [4]Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan
推荐引用方式 GB/T 7714	Liu, Johan[1],Wang, Teng[2],Carlberg, Bj?rn[3],et al. Recent Progress of Thermal Interface Materials[C]. 见:2nd Electronics System-Integration Technology Conference. 2008-09-01.

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