Recent Progress of Thermal Interface Materials | |
Liu, Johan[1]; Wang, Teng[2]; Carlberg, Bj?rn[3]; Inoue, Masahiro[4] | |
2008 | |
会议名称 | 2nd Electronics System-Integration Technology Conference |
会议日期 | 2008-09-01 |
页码 | 351-+ |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2345600 |
专题 | 上海大学 |
作者单位 | [1]SMIT Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, SE-412 96 G?teborg, Sweden |School of Automation and Mechanical Engineering, Yan Chang Campus, Shanghai University, Box 282, No. 149 Van Chang Road, Shanghai 200072, China [2]SMIT Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, SE-412 96 G?teborg, Sweden [3]SMIT Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, SE-412 96 G?teborg, Sweden [4]Institute of Scientific and Industrial Research, Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan |
推荐引用方式 GB/T 7714 | Liu, Johan[1],Wang, Teng[2],Carlberg, Bj?rn[3],et al. Recent Progress of Thermal Interface Materials[C]. 见:2nd Electronics System-Integration Technology Conference. 2008-09-01. |
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