| Reliability Characterisation of Bi-modal High Temperature Stable Isotropic Conductive Adhesives | |
| Tao, Wenkai[1]; Chen, Si[2]; Liu, Xiaohua[3]; Cui, Huiwang[4]; Chen, Tianan[5]; Liu, Johan[6] | |
| 2010 | |
| 会议名称 | 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) |
| 会议日期 | 2010-08-16 |
| 页码 | 225-228 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2315559 |
| 专题 | 上海大学 |
| 作者单位 | 1.Shanghai Univ, Sch Mech Engn & Automat, Key State Lab New Displays & Syst Integrat, Shanghai 200072, Peoples R China. 2.Shanghai Univ, Sch Mech Engn & Automat, Key State Lab New Displays & Syst Integrat, Box 282,149 Yan Chang Rd, Shanghai 200072, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Tao, Wenkai[1],Chen, Si[2],Liu, Xiaohua[3],et al. Reliability Characterisation of Bi-modal High Temperature Stable Isotropic Conductive Adhesives[C]. 见:2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP). 2010-08-16. |
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