| The Effect of Modulus on the Performance of Thermal Conductive Adhesives | |
| Hu, Zhili[1]; Yue, Cong[2]; Guo, Xingming[3]; Liu, Johan[4] | |
| 2010 | |
| 会议名称 | 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) |
| 会议日期 | 2010-08-16 |
| 页码 | 648-651 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2314563 |
| 专题 | 上海大学 |
| 作者单位 | 1.Key State Laboratory for New Displays, System Applications and SMIT Center, Shanghai University, Yanchang Road 149, Shanghai 200072, China 2.Shanghai Institute of Applied Mathematics and Mechanics, Shanghai University, Yanchang Road 149, Shanghai 200072, China 3.SMIT Center and BioNano Systems Laboratory, Department of Microtechnology and Nanoscience , Chalmers University of Technology, SE-412 96 G?teborg, Sweden 4.SMIT Ltd Co., No 101 of New Science and Technology Building, Science Park, Yan Chang Road, Shanghai 200072, China 5.SHT Smart High Tech AB, Fysikgr?nd 3, 41296 Gothenburg, Sweden |
| 推荐引用方式 GB/T 7714 | Hu, Zhili[1],Yue, Cong[2],Guo, Xingming[3],et al. The Effect of Modulus on the Performance of Thermal Conductive Adhesives[C]. 见:2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP). 2010-08-16. |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论