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	Study on the application of thermal interface materials for integration of HP-LEDs
	Wu, Jun[1]; Zhuang, Meilin[2]; Li, Shuzhi[3]; Yang, Weiqiao[4]; Zhang, Jianhua[5]
	2010
会议名称	2010 IEEE CPMT Symposium Japan, ICSJ10
会议日期	2010-08-24
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2313887
专题	上海大学
作者单位	[1]School of Mechatronics Engineering and Automation, Shanghai University, Shanghai, 200072, China |Key Laboratory of Advanced Display and System Applications, Ministry of Education, Shanghai University, Shanghai, 200072, China |Shanghai Research Center of Solid-state Lighting Engineering and Technology, Shanghai, 201203, China[2]Shanghai Research Center of Solid-state Lighting Engineering and Technology, Shanghai, 201203, China[3]Shanghai Research Center of Solid-state Lighting Engineering and Technology, Shanghai, 201203, China[4]Shanghai Research Center of Solid-state Lighting Engineering and Technology, Shanghai, 201203, China[5]School of Mechatronics Engineering and Automation, Shanghai University, Shanghai, 200072, China |Key Laboratory of Advanced Display and System Applications, Ministry of Education, Shanghai University, Shanghai, 200072, China
推荐引用方式 GB/T 7714	Wu, Jun[1],Zhuang, Meilin[2],Li, Shuzhi[3],et al. Study on the application of thermal interface materials for integration of HP-LEDs[C]. 见:2010 IEEE CPMT Symposium Japan, ICSJ10. 2010-08-24.

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