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	Reliability study for high temperature stable conductive adhesives
	Tao, Wenkai[1]; Chen, Si[2]; Berggren, P?r[3]; Liu, Johan[4]
	2010
会议名称	2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10
会议日期	2010-02-28
页码	74-77
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2312432
专题	上海大学
作者单位	[1]Key State Laboratory of New Displays and System Applications and SMIT Center, School of Automation and Mechanical Engineering, Shanghai University, 149 Yanchang Rd., Shanghai, 200072, China [2]Key State Laboratory of New Displays and System Applications and SMIT Center, School of Automation and Mechanical Engineering, Shanghai University, 149 Yanchang Rd., Shanghai, 200072, China |SMIT Ltd. Co., No 101 of New Science and Technology Building, Science Park, No 149, Yan Chang Road, Shanghai 200072, China [3]SHT Smart High Tech AB, Nordg?rdsv?gen 19, Se 428 34 K?llered, Sweden [4]Key State Laboratory of New Displays and System Applications and SMIT Center, School of Automation and Mechanical Engineering, Shanghai University, 149 Yanchang Rd., Shanghai, 200072, China |SMIT Center and Bionano Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE-412 96 Gothenburg, Sweden
推荐引用方式 GB/T 7714	Tao, Wenkai[1],Chen, Si[2],Berggren, P?r[3],et al. Reliability study for high temperature stable conductive adhesives[C]. 见:2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. 2010-02-28.

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