Structural evolution of ZnO films deposited by rf magnetron sputtering on glass substrate | |
Liao, Yan-Ping[1]; Zhang, Jian-Hua[2]; Li, Shu-Xin[3]; Guo, Zhan-Sheng[4]; Cao, Jin[5]; Zhu, Wen-Qing[6]; Xifeng, L.[7] | |
刊名 | PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE
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2010 | |
卷号 | 207页码:1850-1853 |
ISSN号 | 1862-6300 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2311080 |
专题 | 上海大学 |
作者单位 | [1]Key Laboratory of Advanced Display and System Applications, Ministry of Education, Shanghai University, 200072 Shanghai, China |TianMa Microelectronics Co., Ltd., 518118 Shenzhen, China [2]Key Laboratory of Advanced Display and System Applications, Ministry of Education, Shanghai University, 200072 Shanghai, China [3]TianMa Microelectronics Co., Ltd., 518118 Shenzhen, China [4]Shanghai Institute of Applied Mathematics and Mechanics, Shanghai University, 200072 Shanghai, China[5]Key Laboratory of Advanced Display and System Applications, Ministry of Education, Shanghai University, 200072 Shanghai, China [6]Key Laboratory of Advanced Display and System Applications, Ministry of Education, Shanghai University, 200072 Shanghai, China [7]Key Laboratory of Advanced Display and System Applications, Ministry of Education, Shanghai University, 200072 Shanghai, China |
推荐引用方式 GB/T 7714 | Liao, Yan-Ping[1],Zhang, Jian-Hua[2],Li, Shu-Xin[3],et al. Structural evolution of ZnO films deposited by rf magnetron sputtering on glass substrate[J]. PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE,2010,207:1850-1853. |
APA | Liao, Yan-Ping[1].,Zhang, Jian-Hua[2].,Li, Shu-Xin[3].,Guo, Zhan-Sheng[4].,Cao, Jin[5].,...&Xifeng, L.[7].(2010).Structural evolution of ZnO films deposited by rf magnetron sputtering on glass substrate.PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE,207,1850-1853. |
MLA | Liao, Yan-Ping[1],et al."Structural evolution of ZnO films deposited by rf magnetron sputtering on glass substrate".PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE 207(2010):1850-1853. |
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