| Recent Progress in The Studies of Low Melting Sn-Based Pb-Free Solders | |
| Lin, Yang[1]; Yin, Luqiao[2]; Wei, Xicheng[3] | |
| 2011 | |
| 会议名称 | 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) |
| 会议日期 | 2011-08-08 |
| 关键词 | Sn-based solder Low melting Pb-free Recent progress Nanoparticles |
| 页码 | 338-341 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2308688 |
| 专题 | 上海大学 |
| 作者单位 | 1.Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 2.Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, POB 143,149 Yanchang Rd, Shanghai 200072, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Lin, Yang[1],Yin, Luqiao[2],Wei, Xicheng[3]. Recent Progress in The Studies of Low Melting Sn-Based Pb-Free Solders[C]. 见:2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP). 2011-08-08. |
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