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Study on the Reliability of High-power LEDs under Temperature Cycle
Huang, Fan[1]; Yin, Luqiao[2]; Li, Shuzhi[3]; Xu, Guangming[4]; Yan, Huafeng[5]; Chen, Yu[6]; Yang, Lianqiao[7]; Zhang, Jianhua[8]
2011
会议名称2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP)
会议日期2011-08-08
关键词High-power LEDs temperature cycle optical performance thermal performance reliability degradation
页码1120-1123
URL标识查看原文
内容类型会议论文
URI标识http://www.corc.org.cn/handle/1471x/2308680
专题上海大学
作者单位1.Shanghai Univ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China.
2.Shanghai Univ, Key Lab Adv Display & Syst Applicat, POB 143,149 Yanchang Rd, Shanghai 200072, Peoples R China.
推荐引用方式
GB/T 7714
Huang, Fan[1],Yin, Luqiao[2],Li, Shuzhi[3],et al. Study on the Reliability of High-power LEDs under Temperature Cycle[C]. 见:2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP). 2011-08-08.
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