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Effects of silicon content and cooling rate on distribution and size of inclusion in silicon steel thin strip
Peng, Qin[1]; Wang, Lei[2]; He, Xianyong[3]; Yang, Rong[4]; Song, Changjiang[5]; Zhai, Qijie[6]
2011
会议名称TMS 2011 - 140th Annual Meeting and Exhibition
会议日期2011-02-27
关键词Near rapid solidification Cooling rate Inclusion Silicon steel
页码661-668
URL标识查看原文
内容类型会议论文
URI标识http://www.corc.org.cn/handle/1471x/2306370
专题上海大学
作者单位1.[1]Shanghai Univ, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China.
2.[2]Shanghai Univ, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China.
3.[3]Shanghai Univ, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China.
4.[4]Shanghai Univ, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China.
5.[5]Shanghai Univ, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China.
6.[6]Shanghai Univ, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China.
推荐引用方式
GB/T 7714
Peng, Qin[1],Wang, Lei[2],He, Xianyong[3],et al. Effects of silicon content and cooling rate on distribution and size of inclusion in silicon steel thin strip[C]. 见:TMS 2011 - 140th Annual Meeting and Exhibition. 2011-02-27.
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