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	Slurry preparation: a key to upgrade CMP efficiency
	Zhang, Chao-Hui[1]; Lei, Hong[2]; Hu, Xiao-Li[3]
	2011
会议名称	International Conference on Advances in Materials and Manufacturing Processes
会议日期	2010-11-06
关键词	slurry preparation chemical mechanical planarization material removal ratio
页码	19-+
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2306205
专题	上海大学
作者单位	[1]School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing 100044, China [2]Research Center of Nano-Science and Nano-Technology, Shanghai University, Shanghai 200436, China [3]Shanghai Dianji University, Shanghai 200245, China
推荐引用方式 GB/T 7714	Zhang, Chao-Hui[1],Lei, Hong[2],Hu, Xiao-Li[3]. Slurry preparation: a key to upgrade CMP efficiency[C]. 见:International Conference on Advances in Materials and Manufacturing Processes. 2010-11-06.

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