QQ客服 官方微博 反馈留言

	The semi-conductor property and corrosion resistance of passive film on electroplated Ni and Cu-Ni alloys
	Wu, Hongyan[1]; Wang, Yi[2]; Zhong, Qingdong[3]; Sheng, Minqi[4]; Du, Hailong[5]; Li, Zhenhua[6]
刊名	JOURNAL OF ELECTROANALYTICAL CHEMISTRY
	2011
卷号	663页码:59-66
关键词	Cu-Ni alloys Passive films Electrochemical impedance spectroscopy Mott-Schottky analysis Anti-corrosion property
ISSN号	1572-6657
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2303238
专题	上海大学
作者单位	1.[1]Shanghai Univ, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China. 2.[2]Shanghai Univ, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China. 3.[3]Shanghai Univ, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China. 4.[4]Shanghai Univ, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China. 5.[5]Shanghai Univ, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China. 6.[6]Shanghai Univ, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China.
推荐引用方式 GB/T 7714	Wu, Hongyan[1],Wang, Yi[2],Zhong, Qingdong[3],et al. The semi-conductor property and corrosion resistance of passive film on electroplated Ni and Cu-Ni alloys[J]. JOURNAL OF ELECTROANALYTICAL CHEMISTRY,2011,663:59-66.
APA	Wu, Hongyan[1],Wang, Yi[2],Zhong, Qingdong[3],Sheng, Minqi[4],Du, Hailong[5],&Li, Zhenhua[6].(2011).The semi-conductor property and corrosion resistance of passive film on electroplated Ni and Cu-Ni alloys.JOURNAL OF ELECTROANALYTICAL CHEMISTRY,663,59-66.
MLA	Wu, Hongyan[1],et al."The semi-conductor property and corrosion resistance of passive film on electroplated Ni and Cu-Ni alloys".JOURNAL OF ELECTROANALYTICAL CHEMISTRY 663(2011):59-66.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。