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	Environmental reliability of nano-structured polymer-metal composite thermal interface material
	Lu, Xiuzhen[1]; Zhuang, Mengke[2]; Zhang, Lei[3]; Ye, Lilei[4]; Liu, Johan[5]
	2012
会议名称	2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012)
会议日期	2012-08-13
页码	1326-1328
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2299576
专题	上海大学
作者单位	1.[1]Shanghai Univ, Key State Lab New Displays & Syst Applicat, Shanghai 200072, Peoples R China. 2.[2]Shanghai Univ, Key State Lab New Displays & Syst Applicat, Shanghai 200072, Peoples R China. 3.[3]Shanghai Univ, Key State Lab New Displays & Syst Applicat, Shanghai 200072, Peoples R China. 4.[4]Shanghai Univ, Key State Lab New Displays & Syst Applicat, Shanghai 200072, Peoples R China. 5.[5]Shanghai Univ, Key State Lab New Displays & Syst Applicat, Shanghai 200072, Peoples R China.
推荐引用方式 GB/T 7714	Lu, Xiuzhen[1],Zhuang, Mengke[2],Zhang, Lei[3],et al. Environmental reliability of nano-structured polymer-metal composite thermal interface material[C]. 见:2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012). 2012-08-13.

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