Effect of Die-attach Materials and Thickness on the Reliability of HP-LED | |
Weng, Fei[1]; Song, Peng[2]; Zhang, Jinlong[3]; Zhang, Jianhua[4]; Yin, Luqiao[5] | |
2013 | |
会议名称 | 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
会议日期 | 2013-08-11 |
关键词 | HP-LED Die-attach Material Thermal Resistance Reliability |
页码 | 1048-1052 |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2291035 |
专题 | 上海大学 |
作者单位 | 1.[1]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 2.[2]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 3.[3]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 4.[4]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 5.[5]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. |
推荐引用方式 GB/T 7714 | Weng, Fei[1],Song, Peng[2],Zhang, Jinlong[3],et al. Effect of Die-attach Materials and Thickness on the Reliability of HP-LED[C]. 见:2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2013-08-11. |
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