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	Effect of Die-attach Materials and Thickness on the Reliability of HP-LED
	Weng, Fei[1]; Song, Peng[2]; Zhang, Jinlong[3]; Zhang, Jianhua[4]; Yin, Luqiao[5]
	2013
会议名称	2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
会议日期	2013-08-11
关键词	HP-LED Die-attach Material Thermal Resistance Reliability
页码	1048-1052
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2291035
专题	上海大学
作者单位	1.[1]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 2.[2]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 3.[3]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 4.[4]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 5.[5]Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China.
推荐引用方式 GB/T 7714	Weng, Fei[1],Song, Peng[2],Zhang, Jinlong[3],et al. Effect of Die-attach Materials and Thickness on the Reliability of HP-LED[C]. 见:2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2013-08-11.

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