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	Characterization of nano-enhanced interconnect materials for fine pitch assembly
	Zhang, Yan[1]; Sitek, Janusz[2]; Fan, Jing-Yu[3]; Ma, Shiwei[4]; Koscielski, Marek[5]; Ye, Lilei[6]; Liu, Johan[7]
刊名	Soldering and Surface Mount Technology
	2014
卷号	26页码:12-17
关键词	CNT Conductive adhesives Flexible PCBs Nano-Ag paste
ISSN号	09540911
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2271002
专题	上海大学
作者单位	[1]Key Laboratory of Advanced Display and System Applications, School of Mechatronics Engineering and Automation, Ministry of Education, Shanghai University, Shanghai, China [2]Soldering Materials Department, Tele and Radio Research Institute, Warsaw, Poland [3]Shanghai Institute of Applied Mathematics and Mechanics, Shanghai University, Shanghai, China [4]Department of Automation, School of Mechatronics Engineering and Automation, Shanghai University, Shanghai, China [5]Soldering Materials Department, Tele and Radio Research Institute, Warsaw, Poland [6]Smart High Tech AB, G?teborg, Sweden [7]SMIT Center, Shanghai University, Shanghai, China |BNSLionano Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Gothenburg, Sweden
推荐引用方式 GB/T 7714	Zhang, Yan[1],Sitek, Janusz[2],Fan, Jing-Yu[3],et al. Characterization of nano-enhanced interconnect materials for fine pitch assembly[J]. Soldering and Surface Mount Technology,2014,26:12-17.
APA	Zhang, Yan[1].,Sitek, Janusz[2].,Fan, Jing-Yu[3].,Ma, Shiwei[4].,Koscielski, Marek[5].,...&Liu, Johan[7].(2014).Characterization of nano-enhanced interconnect materials for fine pitch assembly.Soldering and Surface Mount Technology,26,12-17.
MLA	Zhang, Yan[1],et al."Characterization of nano-enhanced interconnect materials for fine pitch assembly".Soldering and Surface Mount Technology 26(2014):12-17.

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